? 2007 teledyne relays grf300/grf303 page grf300grf303\072007\q internal construction series grf300 grf303 surface mount, high repeatability, signal integrity to 10gpbs broadband to-5 relays dpdt description the ultraminiature grf300 and grf303 relays are designed to provide a practical surface-mount solution with improved rf signal repeatability over the frequency range. grf300 and grf303 relays feature a unique ground shield that isolates and shields each lead to ensure excellent contact- to-contact and pole-to-pole isolation. the grf300/grf303 version with the improved ground connections can push the performance up into the 10gbps data rates for digital signal integrity applications. this ground shield provides a ground interface that results in improved high- frequency performance as well as parametric repeatability. the grf300 and grf303 extend performance advantages over similar rf devices that simply offer formed leads for surface mounting. these relays are engineered for use in rf attenuator, rf switch matrices, ate and other applications that require dependable high frequency signal fidelity and performance. the grf300 and grf303 feature: ? high repeatability ? broader bandwidth ? metal enclosure for emi shielding ? high isolation between control and signal paths ? high resistance to esd the following unique construction features and manufacturing techniques provide excellent robustness to environmental extremes and overall high reliability: ? uniframe motor design provides high magnetic efficiency and mechanical rigidity ? minimum mass components and welded construction provide maximum resistance to shock and vibration ? advanced cleaning techniques provide maximum assurance of internal cleanliness ? gold-plated precious metal alloy contacts ensure reliable switching ? hermetically sealed series designation relay type grf300 repeatable, signal integrity, rf to-5 relay grf303 sensitive, repeatable, signal integrity, rf to-5 relay environmental and physical specifications temperature (ambient) storage C65c to + 25c operating C55c to +85c vibration (general note ) 0 gs to 500 hz shock (general note ) 30 gs, 6ms half sine enclosure hermetically sealed weight grf300 0.09 oz. (2.55g) max. grf303 0. 6 oz. (4.5g) max. upper stationary contact moving contact lower stationary contact ground shield uniframe armature
? 2007 teledyne relays grf300/grf303 page 5 grf300grf303\072007\q contact arrangement 2 form c (dpdt) rated duty continuous contact resistance 0. 5 max. contact load rating resistive: amp/28vdc low level: 0 to 50 a @ 0 to 50mv contact life ratings 0,000,000 cycles (typical) at low level coil operating power grf300-5 500 m w typical @ nominal rated voltage grf300-12 370 m w typical @ nominal rated voltage GRF303-5 250 m w typical @ nominal rated voltage grf303-12 69 m w typical @ nominal rated voltage operate time grf300 4.0 msec max. grf303 6.0 msec max. release time grf300 3.0 msec max. grf303 3.0 msec max. intercontact capacitance 0.4 pf typical insulation resistance ,000 m min. between mutually isolated terminals dielectric strength 350 vrms/60hz @ atmospheric pressure series grf300 and grf303 general electrical specifications (@25c unless otherwise noted) (notes 2 & 3) detailed electrical specifications (@25c) base part numbers grf300-5 GRF303-5 grf300-12 grf303-12 coil voltage, nominal (vdc) 5.0 2.0 coil resistance (ohms 20%) grf300 50 390 grf303 00 850 pick-up voltage (vdc, max.) 3.6 9.0 .375 max .425 max (10.6) (grf313) .315 max (8) (grf300) (9.52) .335 max (8.51) .035 ref (.89) 36 3 typ .031 (.79) ref .035 (.89) ref .200 .010 (5.98 0.25) dia. see note 3 u.s. patent pending 6 leads (0.43) +0.05 -0.03 .017 +.002 -.001 dia. .033 (0.84) ref length schematic - terminal view pin numbers are for reference only; not marked on relay 2 3 4 1 8 7 6 9 notes: 1. dimensions are in inches. metric equivalents in millimeters are shown in ( ). 2. unless otherwise specified, tolerances on dimensions are .010 inch (0.025 mm). 3. for optimal rf performance, solder bottom of ground shield to pcb rf ground plane. outline dimensions general notes . relays will exhibit no contact chatter in excess of 0 sec or transfer in excess of sec. 2. unless otherwise specified, parameters are initial values. 3. relays may be subjected to 260c, peak solder reflow temperature, minute, 3 passes. 4. butt-lead ends are coplanar within .003" (0.08mm). 5. application notes available for pcb layout and mounting information.
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